We recently had the revelation that Taiwan Semiconductor Manufacturing Company (or TSMC as it is better known) was developing its own 7nm chipset, aiming to gain market share and rival other strong names in developing this type of component.
Following this move, the company has quietly revealed that it has implemented improvements to the manufacturing process in both the 7nm deep-UV DUV (N7) and 5nm version, called the EUV E-UV (N5).
These technologies are focused on serving customers who want to purchase 7nm components that have higher performance potential without compromising power consumption, especially welcome since in some cases this is directly related to mobile devices.
According to estimates, the new N7P process uses the same standards seen in N7 for optimization, providing up to 7% power gain or 10% performance at the same frequency.
To produce the N7P, TSMC uses a technology known as deep ultraviolet lithography (DUV), which has been shown to reduce transistor density when compared to the previous version, called N7.
For customers requiring density greater than 18% to 20%, combined technologies are most likely to be used using the N7 and N6 process, the latter being based on multi-layer ultraviolet lithography (EUV).
In addition, it will also have a performance-enhanced version called the N5P that will utilize MOL and FEOL optimizations to increase the chip’s operating speed by 7% at the same power or 15% at the same frequency.