HMD Global does not give up and tries again. The Finnish company is in fact working on the next top-of-the-range Nokia smartphone. In particular, according to what has been leaked in the last few hours, 11 November (the day of the Single’s Day in China, a sort of Prime Day in Asian sauce) would have been identified as the day of presentation of the new flagship. The device on which, however, expectations have risen dramatically, especially with regard to the photographic sector.
It will likely be called the Nokia X70 and should be equipped with a custom sensor co-designed with Nokia Technologies. A choice dictated by the desire to differentiate, in a market where standardization is king. However, the adoption of Qualcomm‘s Snapdragon 888 combined with 12 Gigabytes of RAM seems obvious. There is currently no information regarding the display and design. Certainly, however, support the 5G standard.
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However, the X series will also consist of another model. In fact, rumors have been running for weeks on the Nokia X50, a smartphone that should be positioned in the medium-high range of the market. In this case, we are talking about a 6.5-inch screen with a 120 Hertz refresh rate, Snapdragon 775 processor, 108 Megapixel main camera with Zeiss optics, 6,000 mAh (milliampere-hour) battery.
Other levels in short compared to the Nokia X10 and X20 presented in April. This is an evident sign of how HMD Global has not given up on presiding over most of the price ranges. After all, the Nokia brand continues to have a certain appeal, although the 9 series has not met the hoped-for success. The fault of a design that is probably a little too bold, but also of unconvincing marketing support.
We’ll see if the Nokia X70 can turn around. The indiscretion regarding the November 11 presentation came from Zhang Yucheng, Product Manager of HMD Global in China. A certainly authoritative figure, who however did not reveal particular details about the device. Over the next few weeks, we will probably have more complete information available.
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