NAND 3D technology matures and makes possible the arrival of SSDs for domestic consumption with higher capacities
The Samsung announced that it is already able to produce its 3D NAND chips in capacity 1 TB (terabit). Increasing the possible density in these chips can enable, with the stacking of 16 of them, SSDs with 2 TB modules to become reality by 2018.
Although the prices of these units should not be cheap, the advance should favor the price drop in solid state disks because of the better performance. In addition to applications on SSDs for computers and laptops, this technology can be used to create storage units on phones and tablets.
There is an important distinction to make: 2 TB SSDs already exist, but what Samsung is promising are 2TB modules, opening up the possibility that solid, future-oriented, consumer-oriented units reach much larger amounts of space.
NAND 3D technology basically consists of cells (or individual chips) that are arranged in vertical layers. Each layer corresponds to one chip and the sum of them all results in the total capacity available in a single module.
SSDs can, and most often have, a number of modules that add up to the total capacity of the unit. Because of this, the manufacturer of high-capacity modules for storage can prove to be fundamental in the cheapness of technology in the future.
In addition to advantages related to power consumption and speed (electricity encounters less resistance and distances to win in a vertical design than you would find on a horizontal), SSDs using 3D NAND technology are often more resilient and reliable.
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